SPK-500S Wide Plasma Cleaning Machine

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SPK-500S  Wide Plasma Cleaning Machine

Outline:

SPK-500S Wide Plasma Cleaning Machine(Plasma cleaner),the gas is separated into plasma state through the excitation power supply, and the plasma ACTS on the product surface to clean the pollutants on the product surface, so as to improve the surface activity and enhance the adhesion.Plasma cleaning is a new, environmental protection, efficient and stable surface treatment.

SPK-500S  Wide Plasma Cleaning Machine

Product feature:

1.A dielectric is placed between the metal electrodes, and a uniform electric field is formed and a plasma is generated by taking advantage of the polarization phenomenon on the surface of the dielectric.

2.It can form plasma on a large scale and can be used with automatic pipeline;

3.More reliable power amplifier and dc module, using automatic vacuum capacitor matcher to provide long-term stable process time guarantee;

4.Suitable for mass production of large size products;

5.Low treatment temperature, conventional treatment temperature < 40℃.

 

Industry application:

1.Display industry: TP fitting, panel surface activation, surface cleaning before ITO coating;

2.Glass cover industry: AF coating pretreatment, AF/AS overflow plating removal, ink printing;

3.Semiconductor: integrated package bonding, Wire bond pretreatment, ceramic packaging, BGA/LED surface activation;

4.Circuit board: FPC/PCB organic cleaning and surface activation;

5.Plastic industry: surface modification, surface coarsening.

 

 SPK-500S  Wide Plasma Cleaning Machine

Specification of equipment:

 

Broad plasma host

Specification of the machineL1800×W1107×H1408mm
Weight280Kg
 

Requirements planning

AC 220V/50Hz single phase 2.5KW
Plasma generator specification
POWER0-600W adjustable
Mains frequency13.56MHz
Matcher 

Fully automatic vacuum capacitor matching unit

 

Plasma gun head specification
Treatment process800mm
Spear head sizeL570*W90*H74mm
Weight10Kg
 

The gun head is adjustable in height

 

0-10mm(regulation precision ±0.3)
 

Common processing height

 

 

From 1 to 5 mm or less

 

 

Cooling range of gun head

 

25-35℃
Process gas
The use of gasAr with O2 Two way gas
Ar Gas regulation range

 

 

≤50L/min
O2 Gas regulation range

 

 

≤50SCCM
Pipeline specification
Pipeline speed 

0-100 – mm/s is adjustable

 

Feed belt1.5M
The belt materialskid resistance PU
Induction and alarm
Sensing systemCard and lamination induction and emergency stop
Call the policeWith sound and light alarm function

 

2.2 Factory specifications

Installation environment requirements
Demand for power supplyAC 220V/50Hz single phase 2.5KW
 

Hvac, argon gas

(Ar)

pressure:0.3-0.8Mpa

flow:15-50L/min

purity:99.99%

 

The equipments of oxygen

(O2)

pressure:0.1-0.5Mpa

 

flow:0-100mL/min

purity:99.99%

Service clearance100cm

 

 

 

2.3 General Requirements

General Requirements
Risk identification 

High pressure hazard identification

 

Service environment 

temperature:15~30℃

humidity:30~70%

 

Other matters needing attention

No combustible gases, corrosive gases, explosions or reactive dust

 

 

 

 

 

 

Configuration list
Serial numberNameModel and specificationQuantity 

Remark

1Plasma power0-600W1
2 

Plasma matching unit

 

matcher1
3Assembly line 

Length 1800 mm * 520 mm wide

 

 

1
4PLCPanasonic PLC1
5Low voltage appliances 

Conventional electrical appliance

 

 

1
6FlowmeterAr  And  O22
7Cooling-water machine450W,5-35℃1
8 

Plasma head

 

R5001

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