Printed circuit board is an important part of electronic products, its performance and reliability directly affect the quality and life of the whole electronic products.In order to ensure that PCB has stable performance and reliable work in practical application, high and low temperature test is needed.
Components and circuits on PCB in high temperature environment are prone to thermal expansion, aging and other problems, resulting in PCB performance degradation or even failure.PCB will also have similar problems in low temperature environment, such as low temperature embrittlement, structural deformation, etc.Through high and low temperature tests, the PCB can be simulated in extreme environment, its tolerance can be evaluated, and the solution can be found.In addition, the components and circuits on PCB often need to work in different temperature ranges, so the high and low temperature test can help to determine the applicable temperature range and working conditions of PCB, and provide a basis for product design and production.
High and low temperature test chamber on printed circuit board test high and low temperature test
High and low temperature test chamber on printed circuit board test high and low temperature test
The high and low temperature test chamber tests the durability, performance and reliability of printed circuit boards at high and low temperatures to help manufacturers determine better design and material choices during product development and improvement.High and low temperature test chamber is also a very common application in the high and low temperature test of printed circuit board. The following are the test steps:
Prepare samples: Prepare samples of printed circuit boards to be tested to ensure that they conform to test standards and specifications.
Place samples: Place samples in a high and low temperature test chamber to ensure that they do not touch or damage each other.
Set the temperature: set the high and low temperature range and temperature change rate of the test chamber, and preheat according to the test requirements.
Conduct testing: Initiate testing and monitor and record changes in temperature, time and appearance of the board according to test criteria.
Observation result: After the test, observe the appearance and performance changes of the circuit board, such as damage or deformation, and record the time and reason of its occurrence.
Analysis results: The test results are analyzed to determine the performance and reliability of the circuit board in high and low temperature environment, and improve or optimize it according to the test results.