Machine de nettoyage au plasma large SPK-500S

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Machine de nettoyage au plasma large SPK-500S

Présenter:

SPK-500S Wide Plasma Cleaning Machine(Nettoyeur plasma),le gaz est séparé à l'état de plasma par l'alimentation d'excitation, et le plasma AGIT sur la surface du produit pour nettoyer les polluants à la surface du produit, afin d'améliorer l'activité de surface et d'améliorer l'adhérence. Le nettoyage au plasma est un nouveau, protection environnementale, traitement de surface efficace et stable.

Machine de nettoyage au plasma large SPK-500S

Pcaractéristique du produit:

1.A dielectric is placed between the metal electrodes, and a uniform electric field is formed and a plasma is generated by taking advantage of the polarization phenomenon on the surface of the dielectric.

2.It can form plasma on a large scale and can be used with automatic pipeline;

3.More reliable power amplifier and dc module, using automatic vacuum capacitor matcher to provide long-term stable process time guarantee;

4.Suitable for mass production of large size products;

5.Low treatment temperature, conventional treatment temperature < 40℃.

 

jeapplication industrielle:

1.Display industry: TP fitting, panel surface activation, surface cleaning before ITO coating;

2.Glass cover industry: AF coating pretreatment, AF/AS overflow plating removal, ink printing;

3.Semiconductor: integrated package bonding, Wire bond pretreatment, ceramic packaging, BGA/LED surface activation;

4.Circuit board: FPC/PCB organic cleaning and surface activation;

5.Plastic industry: surface modification, surface coarsening.

 

Machine de nettoyage au plasma large SPK-500S

Sspécification de l'équipement:

 

Broad plasma host

Specification of the machineL1800×W1107×H1408mm
Lester280Kg
 

Requirements planning

AC 220V/50Hz single phase 2.5KW
Plasma generator specification
POWER0-600W adjustable
Mains frequency13.56MHz
Matcher 

Unité d'adaptation de condensateur à vide entièrement automatique

 

Plasma gun head specification
Treatment process800mm
Spear head sizeL570*W90*H74mm
Lester10Kg
 

The gun head is adjustable in height

 

0-10mm(regulation precision ±0.3)
 

Common processing height

 

 

From 1 à 5 mm ou moins

 

 

Cooling range of gun head

 

25-35℃
Process gas
The use of gasAr with O2 Two way gas
Ar Gas regulation range

 

 

≤50L/min
O2 Gas regulation range

 

 

≤50SCCM
Pipeline specification
Pipeline speed 

0-100 – mm/s is adjustable

 

Feed belt1.5M
The belt materialskid resistance PU
Induction and alarm
Sensing systemCard and lamination induction and emergency stop
Call the policeWith sound and light alarm function

 

2.2 Spécifications d'usine

Installation environment requirements
Demand for power supplyAC 220V/50Hz single phase 2.5KW
 

Hvac, argon gas

(Ar)

pression:0.3-0.8MPa

flow:15-50L/min

pureté:99.99%

 

The equipments of oxygen

(O2)

pression:0.1-0.5MPa

 

flow:0-100mL/min

pureté:99.99%

Service clearance100cm

 

 

 

2.3 General Requirements

General Requirements
Identification des risques 

Identification des dangers liés à la haute pression

 

Environnement de service 

Température:15~30℃

humidité:30~70 %

 

Autres questions nécessitant une attention particulière

gaz non combustibles, gaz corrosifs, explosions ou poussières réactives

 

 

 

 

 

 

Liste de configuration
Serial numberNomModel and specificationQuantity 

Remarque

1Plasma power0-600W1
2 

Plasma matching unit

 

matcher1
3Assembly line 

Longueur 1800 mm * 520 mm wide

 

 

1
4APIPanasonic PLC1
5Low voltage appliances 

Conventional electrical appliance

 

 

1
6DébitmètreAr And O22
7Cooling-water machine450W,5-35℃1
8 

Plasma head

 

R5001

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