LS-USC Dry Cleaning Machine

LS-USC Dry Cleaning Machine

Ultrasonic dust cleaning machine non-contact processing,USC dry cleaning machine
Caracteristicas de producto
1. Non-contact structure, avoid material damage
2. It is not affected by material thickness
3. Reduce energy consumption
4. It will not damage the airflow balance of the production workshop
5. Reduce production costs
6. Shorten the length of production line

Ultrasonic dust cleaning machine non-contact processing,USC dry cleaning machine
Overview/principle

Principle of dry ultrasonic cleaning machine: before dust removal, surface static electricity is removed by electrostatic elimination device, and then the boundary layer of dust and material is broken by specially designed dust removal unit. The dust on the surface of material is loosened by ultrasonic air flow vibration generated by dust removal unit and sucked away by vacuum suction, so as to achieve the effect of dust removal.

Ultrasonic dust cleaning machine non-contact processing,USC dry cleaning machine
Caracteristicas de producto
1. Non-contact structure, avoid material damage
2. It is not affected by material thickness
3. Reduce energy consumption
4. It will not damage the airflow balance of the production workshop
5. Reduce production costs
6. Shorten the length of production line

Ultrasonic dust cleaning machine non-contact processing,USC dry cleaning machine
Overview/principle

Principle of dry ultrasonic cleaning machine: before dust removal, surface static electricity is removed by electrostatic elimination device, and then the boundary layer of dust and material is broken by specially designed dust removal unit. The dust on the surface of material is loosened by ultrasonic air flow vibration generated by dust removal unit and sucked away by vacuum suction, so as to achieve the effect of dust removal.

Ultrasonic dust cleaning machine non-contact processing,USC dry cleaning machine
Industria de aplicaciones
1.La industria de semiconductores
2.industria de la exhibición
3.LED industry
4.Industria de PCB/FPC
5.Camera module
6.Battery industry