SPK-500S Wide Plasma Cleaning Machine

  • Beschreibung
  • Anfrage

SPK-500S Wide Plasma Cleaning Machine

Umriss:

SPK-500S Wide Plasma Cleaning Machine(Plasma-Reiniger),Das Gas wird durch die Anregungsstromversorgung in den Plasmazustand getrennt, und das Plasma wirkt auf die Produktoberfläche, um die Schadstoffe auf der Produktoberfläche zu reinigen, um die Oberflächenaktivität zu verbessern und die Haftung zu verbessern. Plasmareinigung ist neu, Umweltschutz, effiziente und stabile Oberflächenbehandlung.

SPK-500S Wide Plasma Cleaning Machine

PProduktmerkmal:

1.A dielectric is placed between the metal electrodes, and a uniform electric field is formed and a plasma is generated by taking advantage of the polarization phenomenon on the surface of the dielectric.

2.It can form plasma on a large scale and can be used with automatic pipeline;

3.More reliable power amplifier and dc module, using automatic vacuum capacitor matcher to provide long-term stable process time guarantee;

4.Suitable for mass production of large size products;

5.Low treatment temperature, conventional treatment temperature < 40℃.

 

ichindustrielle Anwendung:

1.Display-Industrie: TP fitting, panel surface activation, surface cleaning before ITO coating;

2.Glass cover industry: AF coating pretreatment, AF/AS overflow plating removal, Tintendruck;

3.Semiconductor: integrated package bonding, Wire bond pretreatment, ceramic packaging, BGA/LED surface activation;

4.Circuit board: FPC/PCB organic cleaning and surface activation;

5.Kunststoffindustrie: surface modification, surface coarsening.

 

SPK-500S Wide Plasma Cleaning Machine

SSpezifikation der Ausrüstung:

 

Broad plasma host

Specification of the machineL1800×W1107×H1408mm
Gewicht280Kg
 

Requirements planning

AC 220V/50Hz single phase 2.5KW
Plasma generator specification
POWER0-600Breite verstellbar
Netzfrequenz13.56MHz
Matcher 

Vollautomatische Vakuumkondensator-Anpasseinheit

 

Plasma gun head specification
Treatment process800mm
SpeerkopfgrößeL570*W90*H74mm
Gewicht10Kg
 

The gun head is adjustable in height

 

0-10mm(regulation precision ±0.3)
 

Common processing height

 

 

From 1 zu 5 mm or less

 

 

Cooling range of gun head

 

25-35℃
Process gas
The use of gasAr with O2 Two way gas
Ar Gas regulation range

 

 

≤50L/min
O2 Gas regulation range

 

 

≤50SCCM
Pipeline specification
Pipeline speed 

0-100 – mm/s is adjustable

 

Feed belt1.5M.
The belt materialskid resistance PU
Induction and alarm
Sensing systemCard and lamination induction and emergency stop
Call the policeWith sound and light alarm function

 

2.2 Werksspezifikationen

Installation environment requirements
Demand for power supplyAC 220V/50Hz single phase 2.5KW
 

Hvac, argon gas

(Ar)

Druck:0.3-0.8Mpa

Fluss:15-50L/min

purity:99.99%

 

The equipments of oxygen

(O2)

Druck:0.1-0.5Mpa

 

Fluss:0-100mL/min

purity:99.99%

Service clearance100cm

 

 

 

2.3 General Requirements

General Requirements
Risiko-Einschätzung 

Identifizierung von Hochdruckgefahren

 

Serviceumgebung 

Temperatur:15~30℃

Feuchtigkeit:30~70 %

 

Andere Angelegenheiten, die Aufmerksamkeit erfordern

Nicht brennbare Gase, korrosive Gase, Explosionen oder reaktiver Staub

 

 

 

 

 

 

Konfigurationsliste
Serial numberNameModel and specificationQuantity 

Anmerkung

1Plasma power0-600W.1
2 

Plasma matching unit

 

matcher1
3Assembly line 

Länge 1800 mm * 520 mm wide

 

 

1
4SPSPanasonic PLC1
5Low voltage appliances 

Conventional electrical appliance

 

 

1
6DurchflussmesserAr And O22
7Cooling-water machine450W.,5-35℃1
8 

Plasma head

 

R5001

Kontaktiere uns